C1020 Oxygen-Free Cu Plate
Production information
Description
C1020 Oxygen Free Copper Plate
Ultra low oxygen content, O2 < 30ppm
Applications
Thermal Modules, Vapor Chambers(VC) or Heat sinks
Chemical Contents
Cu |
P |
>=99.98 |
- |
(Wt%) |
Physical Properties
Quality Grade |
Thermal Conductivity |
Density |
Elastic Modulus |
Electric Conductivity |
O |
391 |
8.94 |
118 |
>=97 |