EV Cars
Description
C1020 Oxygen Free Copper Plate
Ultra low oxygen content, O2 < 30ppm
Applications
Thermal Modules, Vapor Chambers(VC) or Heat sinks
Chemical Contents
|
Cu |
P |
|
>=99.98 |
- |
|
(Wt%) |
|
Physical Properties
|
Quality Grade |
Thermal Conductivity |
Density |
Elastic Modulus |
Electric Conductivity |
|
O |
391 |
8.94 |
118 |
>=97 |
Description
DSC-3N, a special alloy with effective combination of
High thermal conductivity (above 350W/m·K)
Softening resistance (200K higher than C10200)
High tensile strength (30% higher than C10200).
High electric conductivity 92%IACS.
Compare to C1020, heat resistance increased by 100℃, strength increased by 30%.
Excellent thermal conductivity while using lead-free solder in assembly process
Applications
Main applications: heat sink bases, head spreaders, high current terminals, bus bars, lead frames
thermal devices, bus bars, IC lead frame, and high power applications.
Chemical Contents
| Cu | Fe + Ni + Sn + Zn + P | |
| 99.9 | 0.1 | |
| (Wt%) | ||
Physical Properties
| Quality Grade | Tensile Strength (N/mm2) |
Yield Strength (N/mm2) |
Hardness (HV) |
Elongation (%) |
|
O |
250-320 |
140 |
≥90 |
≥30 |
|
1/4H |
280-350 |
280 |
90-120 |
≥15 |
|
1/2H |
320-390 |
340 |
100-130 |
≥8 |
|
H |
370-440 |
410 |
110-140 |
≥5 |
|
EH |
≥400 |
450 |
≥120 |
≥3 |
Description
high hardness, strength and heat resistance
A good and lower cost replacement of low-Beryllium Copper
Applications
Connectors, heat dissipation and any parts require higher hardness
Chemical Content
| Ni | Si | Mn | Cu |
| 3.0 | 0.65 | 0.15 | Bal. |
| (Wt%) | |||
| Quality Grade | Tensile Strength (N/mm2) |
Yield Strength (N/mm2) |
Hardness (HV) |
Elongation (%) |
Electric Conductivity (%IACS) |
| TM02 | 655~827 | 596~760 | >190 | >7 | 46 |
| TM03 | 690~860 | 655~830 | >200 | >5 | 46 |