C1020 Oxygen-Free Cu Plate

Production information

Description
C1020 Oxygen Free Copper Plate
Ultra low oxygen content, O2 < 30ppm

Applications
Thermal Modules, Vapor Chambers(VC) or Heat sinks

Chemical Contents

Cu

P

>=99.98

-

(Wt%)

Physical Properties

Quality Grade

Thermal Conductivity
(W/m.K)

Density
(g/cm3)

Elastic Modulus
(Gpa)

Electric Conductivity
(%IACS)

O

391

8.94

118

>=97

 

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